2007 Proceedings

Microelectronics Reliability & Qualification Workshop

Tuesday, December 4, 2007

Welcome and Opening Remarks
Ronald Lacoe, Workshop Chair, Technical Program Co-Chair
The Aerospace Corporation
Yuan Chen, Technical Program Co-Chair, JPL

Keynote Presentation I
Qualification Issues and Pitfalls for Advanced Semiconductor Devices in Space, David Sunderland, Boeing Satellite Development Center

Session I: Product Reliability and Qualification

Session Chair: Yuan Chen, Jet Propulsion Laboratory

1. Physics and Chemistry of Electronics Degradation (PACE) - A pathfinder for Re-establishing DoD's Reliability Assessment Capability Using 21st Century Tools, James Theimer, Air Force Research Laboratories, Wright Patterson AFB
2. Parts, Materials and Processes Management for Optimized Reliability, Steve Bryan, General Dynamics
3. C-RAM Phase Change Memory -- Update on Reliability and Qualification, Ken Hunt, Air Force Research Laboratories, Kirtland AFB
4. FPGA Qualification for DoD Space Systems and FPGA Qualification Status Update, Larry Harzstark, The Aerospace Corporation
5. Physics-of-Failure Approach to Assessing Product Reliability of Scaled Microelectronics, Mark White, Jet Propulsion Laboratory

Session II: Advanced Packaging Technologies

Session Chair: Ken Hunt, Air Force Research Laboratories, Kirtland AFB

1. Packaging Reliability Issues for Extreme Environments, Carissa Tudryn, Jet Propulsion Laboratory
2. FPGA Package Assembly Reliability, Reza Ghaffarian, Jet Propulsion Laboratory

Session III: Radiation Effects on Microelectronics

Session Chair: Keith Avery, Micro-RDC

1. Effects of Single-Event-Induced Charge Sharing in Sub-100nm CMOS Technologies, Oluwole Amusan, Vanderbilt University
2. Radiation Hardness by Design Demonstration at 90 nm, Warren Snapp, Boeing
3. Radiation Testing, Characterization and Qualification Challenges for Modern Microelectronics Technologies, Lew Cohn, Defense Threat Reduction Agency
4. Spacecraft Structural Shielding Mass and the Single Event Effects Environment: A comparison of Upset Rates Calculated with FLUKA, CREME-96, and Peterson's Figure of Merit with International Space Station Flight Data, Steve Koontz, NASA Johnson Space Center

Wednesday, December 5, 2007

Keynote Presentation II
Advanced, Non-Destructive Defect Localization in Microelectronics, Ed Cole, Sandia National Laboratories

Session IV: Failure Analysis/Tin Whiskers

Session Chair: Donna Speckman, The Aerospace Corporation

1. The Importance of Microanalysis in the Aerospace Industry Ð Techniques and Examples, Gary Stupian, The Aerospace Corporation
2. Metal Whiskering: Failure Modes and Mitigation Strategies, Jay Brusse, Perot Systems/NASA Goddard Space Flight Center
3. Understanding Tin Plasmas: A New Approach to Tin Whisker Risk Assessment, Maribeth Mason, The Aerospace Corporation

Session V: Memories

Session Chair: Dave Mavis, Micro-RDC

1. Radiation Effects Challenges in 90nm Commercial-Density SRAMs: A Comprehensive SEE and TID Study, Younes Boulghassoul, University of Southern California, Information Sciences Institute
2. EEPROM Applications and Risk Mitigations, Yuan Chen, Jet Propulsion Laboratory
3. High Reliability Memory Design for Servers Using Low Cost Commodity Components, Charles Slayman, Sun Microsystems

Session VI: FPGA Applications

Session Chair: Jon Osborn, The Aerospace Corporation

1. SET Characterization and Mitigation of ACTEL Flash-Based FPGAs in Heavy Ions and Protons Beams, Sana Rezgui, Actel
2. Determining the Best-Fit FPGA for a Space Mission: An Analysis of Cost, SEU Sensitivity, and Reliability, Melanie Berg, NASA Goddard
3. Effects of Process Scaling on Leading Edge Submicron CMOS Technology, Gary Swift, Xilinx, Inc.
4. Radiation-Hardened by Design Structured ASICs for Reliable Digital Components, Dave Mavis, Micro-RDC

Session VII: Advanced Technologies

Session Chair: Josh Conway/The Aerospace Corporation

1. Hybrid CMOS/Nano Crossbar Circuits: From Devices to Applications, Dmitri Strukov, Hewlett Packard Laboratories
2. Beating Nyquist Sampling Limits: Signal Extraction Using Compressed Sensing, Peter Petre, Hughes Research Laboratory