2005 Proceedings

Microelectronics Reliability & Qualification Workshop

 

Day 1

Opening Remarks, Ronald Lacoe, The Aerospace Corporation

Welcome, Dr. William Ballhaus Jr., President and CEO, The Aerospace Corporation

Keynote Presentation

40+ Years of Failure Analysis—Lessons Learned and Applied in the Development of an Approach for Nanometer-Scale ASIC Qualification, Tom Hoskinson, The Aerospace Corporation

Session I: Failure Analysis Techniques and Applications

Session Chair: Terence Yeoh, The Aerospace Corporation

1. Elimination of an ESD Source Utilizing Failure Analysis Techniques, Field Measurements, and ESD Protection Methods, Don Kinell, Actel Corporation
2. Failure Analysis of MEMs Field Effect Transistor Support Membrane, Saverio D'Agostino, Jet Propulsion Laboratory
3. Failure Analysis of CCD Image Sensor using SQUID and GMR Magnetic Current Imaging, Frederick Felt, NASA Goddard Space Flight Center

Session II: Rad-Hard Foundries Status

Session Chair: Lew Cohn, DTRA

1. Honeywell Rad-Hard Technologies, Gregg Panning, Honeywell International
2. BAE Systems Technology Modernization Status, Nadim Haddad, BAE Systems

Session III: Advanced Technology Reliability and Challenges

Session Chair: Mark White, Jet Propulsion Laboratory

1. Solar Cell and Solar Panel Qualification Standards: Progress in Establishing a Minimum Baseline for Performance, Brad Reed, The Aerospace Corporation
2. The Effect of Gate Metals on Reliability of 0.1 mm InP HEMT MMICs, Peter Yeong-Chang Chou, Northrop Grumman Space Technology
3. The ESD Challenge at 90-nm CMOS Technologies and Beyond, Robert Ashton, White Mountain Labs

Session IV: Photonics Integrated Circuits

Session Chair: Ryan Stevenson, The Aerospace Corporation

1. The Convergence of Photonics and Electronics, Bahram Jalali, University of California, Los Angeles
2. Photonic Integrated Circuits Based on Microresonators, Dan Dapkus, University of Southern California
3. Photonic Integrated Circuits in Future Satellite Systems, John Scarpulla, The Aerospace Corporation

Day 2

Session V: Product Qualification

Session Chair: Yuan Chen, Jet Propulsion Laboratory

1. Strategy for Providing Customers a Rapid Product-Level Reliability Qualification Using Advanced Foundry Technologies, Phil Mason, Agere Systems
2. A Strategy for Qualifying New Technologies for Automotive Applications, Lynette Westergard, AMI Semiconductor
3. Aeroflex RadHard Eclipse FPGA Qualification and Reliability Overviewm, Gerald Matia, UTMC Aeroflex
4. Product Reliability and Qualification Challenges with CMOS Scaling, Mark White, Jet Propulsion Laboratory

Session VI: Radiation Effects on Microelectronics

Session Chair: Harald Schone, Jet Propulsion Laboratory

1. New Results from the DARPA Hardness-by-Design Program – Boeing, Warren Snapp, Boeing Corporation
2. New Results from the DARPA Hardness-by-Design Program – ATK Mission Research, Keith Avery, ATK Mission Research
3. The Role of Structural Shielding Mass in Avionics Performance in Single Event Effect Environments: Implications for the Constellation Program, Steven Koontz, NASA Johnson Space Center

Session VII: FPGA Reliability and Qualification

Session Chair: Jon Osborn, The Aerospace Corporation

1. Space Qualification of FPGAs, Larry Harzstark, The Aerospace Corporation
2. Integrated Qualification Strategies for FPGAs, Doug Sheldon, Jet Propulsion Laboratory
3. The Challenges and Benefits of Partial Mitigation for FPGAs, Michael Wirthlin, Brigham Young University

Session VIII: Advanced Packaging

Session Chair: Reza Ghaffarian, Jet Propulsion Laboratory

1. Current Understanding of the Quality and Reliability of Lead-Free Tin, Andrew D. Kostic, Northrop Grumman Electronic Systems
2. Lead-Free vs. Tin-Lead Reliability of Advanced Electronic Assemblies, Reza Ghaffarian, Jet Propulsion Laboratory
3. CCGA Board Level Testing: Current and Future Activities, Raymond Kuang, Actel Corporation