2004 Proceedings

Microelectrinics Reliability & Qualification Workshop

Day 1

Opening Remarks Ronald Lacoe, The Aerospace Corporation, MRQW Program Chair

Session A-I Keynote Talks I

Session Chair: Ronald Lacoe, The Aerospace Corporation

1. Reconfigurability as a Means of Achieving Highly Reliable and Robust Space Computers, Scott Tyson, Air Force Research Laboratories
2. Reliability and Qualification Challenges for RF Devices, John Scarpulla, The Aerospace Corporation

Session A-II RF Device Reliability

Session Chair: John Scarpulla, The Aerospace Corporation

1. RF CMOS Device and Circuit Reliability Subject to Electrical and Temperature Stress, Peter Yuan, University of Central Florida
2. Hot Carrier Reliability in Space-Qualified GaAs PHEMT MMIC Power Amplifiers Under Large Signal Operation, Peter Yeong-Chang Chou, Northrop Grumman Space Technology

Session A-III Packaging Qualification

Session Chair: Reza Ghaffarian, Jet Propulsion Laboratory

1. Mechanical Qualification of Maxwell's Rad-Stak Package, Lee Lasof, Maxwell Technologies
2. Vibration and Thermo-Mechanical Durability Assessments in Advanced Electronic Package Interconnects, Eric Wong, Raytheon

Session A-IV Memory Technologies

Session Chair: Lew Cohn, DTRA/TDNR

1. Reliability and Qualification of 4Mb Chalcogenide-based Random Access Memory, Ken Hunt, Air Force Research Laboratories
2. Data Retention Characterization Results for a Commercial MNOS EEPROM, Everett King, The Aerospace Corporation

Session A-IV High Reliability FPGA Technology Roadmaps & Qualification

Session Chair: Jon Osborn, The Aerospace Corporation

1. From Space to Base, Leading the Era of Transformation, Joe Fabula, Xilinx
2. Actel Radiation Tolerant FPGAs, Ken O'Neil, Actel Corporation
3. Radiation Tolerant Actel /Xilinx Considerations for Space Application Gary Swift, Jet Propulsion Laboratory

Day 2

Session B-I Keynote Talks II

Session Chair: Kristan Evans, Jet Propulsion Laboratory

1. Reliability Challenges for Advanced Dielectrics and the Implications for Lifetime Projection, John Suehle, NIST
2. Space Microelectronics Failure Analysis: Problem Resolution Issues and Advanced Interconnect Defect Localization, Jerry Soden, Sandia National Laboratories

Session B-II Technology Qualification

Session Chair: Yuan Chen, Jet Propulsion Laboratory

1. Technology Readiness Overview: Ball Grid Array and Chip Scale Packaging, R eza Ghaffarian, Jet Propulsion Laboratory
2. COTS Electronics Reliability - An Assessment of FIDES,
   Lori Bechtold, Boeing
3. Qualification of COTS Components Subjected to Static and Cyclic Use Conditions, Nathan Blattau, CALCE, UMD

Session B-III Radiation Effects

Session Chair: Harald Schone, Jet Propulsion Laboratory

1. Single-Event Effects in Advanced Microelectronics, Lew Cohn, DTRA/TDNR
2. Space Radiation Effects on Optoelectronics, Allan Johnston, Jet Propulsion Laboratory
3. Modeling and Analysis of Radiation-Induced Off-State Leakage for Hardened-By-Design Transistor Topologies, Hugh Barnaby, Ivan SanchezElectrical Engineering, ASU, Tempe, Az
4. Versatile Representation of Radiation Characteristics and Reliability Data for IC Library Cells, Alex Zamfirescu, Alternative System Concepts, Inc.

Session B-IV ESD

Session Chair: Hugh Barnaby, Arizona State University

1. Measurements of Real ESD Threats Have Been Ignored Too Long, Jon Barth, Barth Electronics, Inc.

Closing Remarks Ronald Lacoe, The Aerospace Corporation, MRQW Program Chair