2003 Proceedings

Microelectonics Reliability & Qualification Workshop

Day 1
Session A-I Keynote Talks I

Session Chair: Ronald Lacoe, The Aerospace Corporation

1. Challenges in the use of Microelectronics in Severe Radiation Environments Alan Johnston, NASA-JPL

2. Solar Cell Qualification Test Methodologies: Past, Present, Future Brad Reed, The Aerospace Corporation

Session A-II Memory Technologies

Session Chair: Jefferey Patterson, Jet Propulsion Laboratory

1. Reliability and Qualification of Radiation Hardened Memory Technologies

   Phil Brusius, Honeywell
2. Using Commercial SDRAM in High Reliability Space Applications M. Nelson, Seakr Engineering
3. Reliability of FujitsuÕs Ferroelectric Process Technology Stephen Philpy, Celis/Fujitsu

Session A-III Technology Qualification I

Session Chair: Mohammad Mojarradi, Jet Propulsion Laboratory

1. Trends in Power Semiconductors Qualify and Reliability Implications Richard Zelenka, Micrel Semiconductor
2. Rugged RF MEMS Packaging Strategies Daniel Hyman, XCOM
3. Power IC Challenges and Reliability Solutions Rohit Tirumala, Supertex

Session A-IV Technology Qualification II

Session Chair: Mark White, Jet Propulsion Laboratory

1. Lead Free Component Finishes -- Problems and Mitigations Joe Zaccari, Corfin Industries
2. Using Commercial RF Devices in High Reliability Systems Tom Thornton, CMC Electronics
3. Reliability of Active Array RF Electronics Mark Hauhe, Raytheon

Day 2
Session B-I Keynote Talks II

Session Chair: Sammy Kayali, Jet Propulsion Laboratory

1. Radiation Hardening Through Layout and Circuit Techniques Dave Mavis, Mission Research Corporation

Session B-II Radiation Effects

Session Chair: Donald Mayer, The Aerospace Corporation

1. Space System Radiation Hardness Assurance for Single Event Effects Christian Poivey, NASA-GSFC
2. Review of SOI MOSFET Designs for Total Dose Radiaion Reliability Douglas Hackler, American Semiconductor
3. Improvements in Space Electronics Reliability Through Use of Commercial Semiconductor Manufacturing Scott Tyson, AFRL
4. Reliability and Qualification of Radiation Hardened ASICs P. Brusius, Honeywell

Session B-III Design Qualification

Session Chair: Yuan Chen, Jet Propulsion Laboratory

1. Reliability Testing and Product Qualification Mark Burns, IBM
2. Qualification of Radiation Hardened Mixed Signal Circuits Mark Baze, Boeing
3. Qualification of Silicon On Sapphire Technology for Radiation Hardened ASIC Applications Chuck Tabbert, Peregrine Semiconductor

Session B-IV Packaging Qualification

Session Chair: Reza Ghaffarian, Jet Propulsion Laboratory

1. Assembly and Drop Test Reliability of Lead Free Chip Scale Packages

   Wayne Johnson, Auburn University
2. The Role of Failure Mechanism Identification in Accelerated Qualification of Pb-free Electronics Abhijit Dasgupta, CALCE
3. Failure Detection of Integrated MEMS Package by Optical Monitoring Larry Hornak, University of West Virginia
4. Extreme Temperature Thermal Cycling Tests and Results to Assess Reliability of Hardware for Flight Qualification Rajeshuni Ramesham, NASA-JPL
5. Reliability and Qualification of 3-D Stacks Bonnie Gess, Irvine Sensors