2002 Proceedings

Microelectronics Reliability & Qualification Workshop

Day 1

Keynote: Prediction of Error Rates for Processor Based Architectures: Methods and Experimental Results Raoul Velazco, Laboratoire TIMA, France

Session 1 -- COTS/PEMS Reliability and Qualification

Session Chair: Choon Lee, JPL

1. Electronics Parts Life Extension for Military and Avionic Qualification Joseph B. Bernstein, University of Maryland
2. Use of Simulation Assisted Reliability Assessment to Qualify PEMS Craig Hillman, CALCE
3. Moisture Diffusion Characteristics of Molding Compounds, Their Measurements, and Use for Quality Assurance of PEMs for Space Applications Alexander Teverovsky, NASA Goddard

Session 2 -- Leveraging Commercial Microelectronics for Space

Session Chair: John Suehle, NIST

1. Space Qualification of COTS Memory Bob Bauer, United Technologies Microelectronics Center
2. Enhancing Reliability of Commercial CMOS Processes by the Application of Hardness-By-Design Techniques Donald C. Mayer, Ronald C. Lacoe and Everett E. King, The Aerospace Corporation
3. A Single Event Latchup Suppression Technique for COTS Components Jim Spratt, Jim Pickel, Roland Leadon, Full Circle Research, Inc., and Ronald C. Lacoe, Steve C. Moss, Steve LaLumondiere, The Aerospace Corporation

Session 3 -- Radiation Effects

Session Chair: Allan Johnston, JPL

1. Single Event Transient Phenomena: Challenges and Solutions Dave Mavis, Mission Research Corporation
2. On the Use of In Flight Radiation-Induced Performance Data and Anomalous Resolution of COTS Electronics Ken LaBel and Janet Barth, NASA Goddard, and Christien Poivey, SGT Associates
3. Radiation Effects on a Small DC/DC Converter and a Remedy by Circuit Design Technique Calvin Truong, The Aerospace Corporation

Session 4 -- MEMS Reliability

Session Chair: Rajeshuni Ramesham, JPL

1. MEMS Reliability: Issues and Characterization YSubodh Medhekar, Exponent
2. RF MEMS Switches and Tunable Capacitors Jeffrey DeNatale, Rockwell Scientific Company
3. General Yield and Reliability Considerations for MEMS-Based Flow Systems Albert K. Henning, Redwood Microsystems, Inc.
4. Integrated Microfluidics and Packaging Yu-Chong Tai, California Institute of Technology
5. Magnetic MEMS and their Prospective Reliability Jack W. Judy, University of California, Los Angeles

Day 2

Session 5 -- Advanced Technologies Reliability Challenges

Session Chair: Don Mayer, The Aerospace Corp.

1. Ultra-thin Gate Oxide Reliability and Implications for Qualification, Design, and Use in Ionizing Radiation Environments John S. Suehle, National Institute of Standards
2. Reliability Problems in a High-K Dielectric System: HfO2/Si Patrick M. Lenahan and Andrew Y. Kang, Penn State University, and John F. Conley Jr., Sharp Laboratories
3. Evaluation of the Hot-Carrier Lifetime Under Dynamic Operating Conditions Including New Degradation Mechanisms Everett E. King and Ronald C. Lacoe, The Aerospace Corporation
4. Qualification Procedures of Advanced Technology: 0.1 µm InP HEMT MMICs Peter YC Chou, D. Leung, R. Grundbacher, R. Lai, M. Barsky, Q. Kan, R. Tsai, M. Wojtowicz, D. Eng, T. Block, P.H. Liu, S. Olson, and A. Oki, TRW
5. Degradation Mechanisms in Space-Qualified GaAs HBTs Aaron Oki, Mike Wojtowicz, Jeff Elliott, Rich Kono, Chris Grossman,Tom Block, Frank Yamada, Augusto Gutierrez- Aitken, George McIver and Dwight Streit, TRW

Session 6 -- Advanced Memory Reliability

Session Chair: Sam Kayali, JPL

1. Qualification Issues for Using Commercial DRAMs and Flash Memories for Space Alan Johnston, Jet Propulsion Laboratory
2. Chalcogenide Nonvolatile Memories for Space Ken Hunt, Air Force Research Laboratory, John Rodgers, Ken Knowles, Laura Burcin, BAE Systems, Jon Maimon, Ovonyx
3. Reliability Characterization of COTS FRAMs Under Environmental Stresses for NASA/DOD Applications Ashok K. Sharma and Alexander Teverovsky NASA Goddard, Terry Dowdy and Brett Hamilton, NAVSEA/Crane

Session 7 -- Advanced Microprocessors for Space

Session Chair: Ken Hunt, AFRL

1. Rad750 Experience: The Challenge of SEE Hardening a High Performance Commercial Processor Laura Burcin, BAE Systems
2. RHPPC Reliability and Qualification Lee Hoffman, Honeywell Intl.

Session 8 -- FPGA Reliability

Session Chair: Jon Osborn, The Aerospace Corp.

1. Radiation-Hardened FPGAs for Space Ken Gant, Mission Research Corporation
2. The Effects of Upsets within the Configuration Memory of SRAM FPGAs Michael J. Wirthlin and D. Eric Johnson, Brigham Young University

Session 9 -- Packaging

Session Chair: Everett King, The Aerospace Corp.

1. Ball Grid Array Qualification and Assembly Reliability Risk Assessment Raza Ghaffarian, Jet Propulsion Laboratory
2. Affecting Stress in BGA by Microwave Radiation Application Nasser K Budraa, The Jet Propulsion Laboratory